| PART |
Description |
Maker |
| TLP3904 |
a small outline coupler, suitable for surface mount assembly
|
Toshiba Semiconductor
|
| TLP3213 |
a super small-outline photorelay, suitable for surface-mount assembly
|
Toshiba Semiconductor
|
| HVR100 |
Small Resin Package (SRP) is suitable for surface mount design
|
TY Semiconductor Co., L...
|
| HSU277 |
Low forward resistance Ultra small Resin Package (URP) is suitable for surface mount design
|
TY Semiconductor Co., L...
|
| HSM88ASR |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| MP10C875F10FCA MD10C1842F75FCA MD8C875F10FCA MP10C |
Mono Duplexer (MD & MP Type)
Suitable for surface mount and reflow soldering
|
Vanlong Technology Co., Ltd.
Vanlong Technology Co.,...
|
| STP5N30 STP5N30FI |
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN
|
ST Microelectronics
|
| STW9NA80 |
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN
|
ST Microelectronics
|
| STD2NA60 |
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN
|
ST Microelectronics
|
| STD3N30L-1 |
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN
|
ST Microelectronics
|
| STB18N20 |
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN
|
ST Microelectronics
|
